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    1. 微信公眾號

      Shared foundry runs or Multi-Project Wafers are a cost effective foundry approach well suited for Institutes, Labs, Research Centers and Universities. This service allows different customer projects on a single wafer.

      You will be able to:

      • Try new designs with high performance processes at limited cost
      • Design MMICs not available on the market place with perfect system fit & cost savings
      • Ensure business protection with secured IP & product exclusivity

      Participants have free access to Design Kits.  20 diced & untested MMICs in Gel-Pak® box will eventually be delivered.

      The possible die length and width, including dicing streets, are:

      For high power processes PPH25X, PPH15X:

      • 1.4mm
      • 2mm
      • 2.4mm
      • 3.4mm
      • 4mm
      • 4.4mm

      with maximum aspect ratio 1:3

      For Low noise and multi-purpose processes PH25, PH15, PH10, PPH25, HB20M, HP07, BES

      • 1mm
      • 1.4mm
      • 2.4mm
      • 3.4mm
      • 4mm

      with maximum aspect ratio 1:3

      For passive proces ULRC

      • 1.4mm
      • 2mm
      • 2.4mm
      • 3.4mm


      Price is determined according to die area and process.


      Next MPW runs

      UMS shared foundry runs offer regular Multi Project Wafer runs with information 6 months notice before tape-out.

      Shared foundry runs 2022

      Shared foundry runs 2022 planning

       Next low-medium power process runs

      Next High Power Process run:

      Next Schottky diode process run

      Next Passive process run

      Condition of sales

      Shared runs are scheduled based on customer needs. UMS optimize schedule to meet tape-out date that maximize delivery time agreement with customers.

      Do you need more information?

      Contact us @ tmtnanjing@163.com

      地址:中國南京市玄武區龍蟠路155號紫金聯合立方5幢    郵編:210037

      電話:+86-25-84812008 ; 傳真:+86-25-84812098 ; 電郵:tmtnanjing@163.com

      蘇ICP備14010667號

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